ADLINK Technology Thermal Solutions for Express-BD7 COMs
ADLINK Technology Thermal Solutions for Express-BD7 COMs extend the life span of Computer-on-Modules by dissipating heat. These Thermal Solutions include Heat Spreaders, which conduct heat to other system cooling components, Passive Heatsinks, which dissipate heat using cooling fins, and Active Heatsinks, which include a cooling fan. These Thermal Solutions are specifically designed for the Express-BD7 Modules, ensuring a custom fit and preventing mechanical stress.
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ADLink Technology Express-CF/CFE COM Express Type 6 Modules support the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
Date: 2019-03-07ADLINK Technology Thermal Solutions for Express-BD7 COMs extend the life span of Computer-on-Modules by dissipating heat.
Date: 2018-08-10ADLINK Technology Express-KL/KLE COM Express Type 6 Modules feature 7th Gen Intel® Core™ 7000 series and Intel Xeon® E3 Processors.
Date: 2018-07-13ADLINK Technology Thermal Solutions for cExpress-KL Modules include heat spreaders, passive heatsinks, and active heatsinks.
Date: 2018-07-13ADLINK Technology cExpress-KL COM Express® Module Feature the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and Intel Celeron® Ultra-Low TDP processor.
Date: 2018-07-13ADLINK Technology Express-BD7 Computer-on-Modules are COM Express COM.0 R3.0 Basic Size Type 7 Modules supporting the 64-bit Intel Xeon Processor D and Intel Pentium D Processor System-on-Chip (SoC).
Date: 2018-06-20ADLINK Technology Express-BASE7 is an ATX size COM Express Type 7 Reference Carrier Board.
Date: 2018-06-20ADLINK Technology COM Express Type 7 Starter Kit Plus includes everything needed to design and develop COM Express systems based on Type 7 Modules.
Date: 2018-06-20